ASEAN Scholarships for Malaysia: Pre-University One Scholarships

Students from Malaysia who wish to enter Singapore schools at the Pre-University 1 level under the ASEAN Scholarships are welcome to apply for the Pre-University awards. Candidates who are not short-listed for the scholarships may be considered for the Merit Awards.

Please note that there will be no May intake for the ASEAN Pre-University Scholarships for Malaysia from Year 2006 onwards. Applications for the Year 2013 ASEAN Pre-University Scholarships are open in end February/early March 2012. Short-listed applicants will be required to go through a selection test and an interview before being awarded the scholarship.

Eligibility

Students who meet the following criteria are invited to apply for the scholarship:

Important Dates

Any dates given below are tentative and are subject to changes.

Activity Date
Application Period End February/Early March to Early April 2012
Selection Test June 2012
Selection Interview August 2012
Award of Scholarship October 2012
Arrival of Scholar in Singapore January 2013

Candidates short-listed for the selection test/interview will be notified a week before the selection test / interview dates. We regret that only short-listed candidates will be notified.

Application Procedures

Applications will be opening soon.

Test and Interview Cities

The selection tests and interviews will be conducted in the following cities:

Note:
Kota Kinabalu, Kuching and Penang may be used as Test / Interview Centre if there are sufficient short-listed candidates.

Terms and Conditions

  1. Allowance of S$2,400 per annum with hostel accommodation
  2. Settling-in allowance of S$500 (once only)
  3. Economy class air passage (for East Malaysians) or S$50 transport allowance (for West Malaysians) to Singapore and back to home country upon completion of scholarship term
  4. Waiver of school fees (excluding miscellaneous fees)
  5. Waiver of GCE A-Level (or equivalent) examination fees (once only, if applicable)
  6. Subsidised medical benefits and accident insurance cover
  7. There is no bond attached to the scholarship